2UUL MagGrid Magnetic Planting Tin Pad Universal BGA Reballing Stencil Absorption Silicone Mat Mobile Phone CPU IC Repair Pad

2UUL BH15 MagGrid Magnetic Silicone Pad for Mobile Phone CPU Nand Flash IC BGA Chip Stencils Repair Reballing Soldering Mat

2UUL MagGrid Magnetic Planting Tin Pad Universal BGA Reballing Stencil Absorption Silicone Mat Mobile Phone CPU IC Repair Pad

Description
2UUL BH15 MagGrid Pad Chip Silicone Buffer Soldering Pad for Mobile Phone CPU Nand Flash IC BGA Chip Welding Repair. 2UUL BH15 MagGrid Magnetic Silicone Pad with 0.3mm 0.4mm 0.5mm 0.8mm chip slot, suitable for various Phone CPU Nand chip and BGA chip soldering, reballing, and repair.

Product Parameters:
Name: 2UUL BH15 MagGrid Pad Chip Silicone Buffer Soldering Pad
Net Weight: 65.5g
Product Size: 104mmx80mmx8mm
Package Size: 130mmx84mmx11mm
Gross Weight: 78.5g

Features:
1.  Rubber magnetic tin planting pad, soft silicone material, strong magnetic adsorption, high temperature resistance, easy to clean.
2.  Curved design, strong magnetic adsorption, seamless fitness, hands-free.
3.  Makes the tin planting net BGA stencil not easy to fall off and shift, making the chip tin planting more firm and stable.
4.  Planting hole heat dissipation roller, hollow heat dissipation hole design on the back of the planting pot net, the planting pot has good heat dissipation effect, and the steel net planting pot will not bulge
5.  High temperature resistant,soft silicone, elastic cushioning, can withstand high temperatures up to 500℃.